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Reticle Holders CNC Machining for Photolithography Systems
Reticle holders are ultra-precision mounting devices that position and secure photomasks during lithography exposure in semiconductor manufacturing equipment. At Zintilon, we specialize in CNC machining of reticle holders using advanced grinding and lapping to achieve exceptional flatness, thermal stability, and contamination control for nanometer pattern transfer accuracy in advanced photolithography systems.
- Machining for complex holder geometries and clamping surfaces
- Tight tolerances up to ±0.0001 in
- Ultra-precision grinding, lapping & low-expansion materials
- Support for rapid prototyping and full-scale production
- ISO 9001-certified photolithography component manufacturing
Trusted by 15,000+ businesses
Why Semi-Concductor Companies
Choose Zintilon
Increased Productivity
Engineers get time back by not dealing with immature supply chains or lack of supply chain staffing in their company and get parts fast.
10x Tighter Tolerances
Zintilon can machine parts with tolerances as tight as+/ - 0.0001 in -10x greater precision compared to other leading services.
World Class Quality
Zintilon provides aerospace parts for leading aerospace enterprises, verified to be compliant with ISO9001 quality standard by a certified registrar. Also, our network includes AS9100 certified manufacturing partners, as needed.
From Prototyping to Mass Production
Zintilon provides CNC machining for reticle holders and related photomask handling components for semiconductor equipment manufacturers, lithography tool suppliers, and advanced packaging facilities worldwide.
Prototype Load Lock Frames
Obtain high-precision prototypes of reticle holders that accurately replicate your final design. Test flatness, verify clamping uniformity, and ensure contamination-free mask handling before full-scale production.
Key Point
Key Point
- Rapid prototyping with ultra-precision
- Tight tolerances (±0.0001 in)
- Test design, flatness, and thermal stability early
EVT – Engineering Validation Test
Rapidly iterate reticle holder prototypes to assess compliance with all flatness and contaminant criteria. Identify issues early to enable smooth transitions to photolithography's advanced photolithography segmentation.
Key Point
Key Point
- Validate prototype functionality
- Rapid design iterations
- Ensure readiness for production
DVT – Design Validation Test
Before mass production, confirm the reticle holders’ dimensions, assess the varied materials’ thermal characteristics, and determine thermal performance relative to design expectations to canvass for pattern placement optimization.
Key Point
Key Point
- Confirm design integrity and flatness
- Test multiple materials and thermal characteristics
- Ensure production-ready performance
PVT – Production Validation Test
Evaluate the reticle holders’ bulk production to reveal possible inefficiencies and production bottlenecks to guarantee streamlined production for the reticle holders.
Key Point
Key Point
- Test large-stage production capability
- Detect and fix process issues early
- Ensure consistent part quality
Mass Production
Issue high precision ultra-accuracy reticle holders for lithography equipment manufacturers and downstream semiconductor fabrication plants, meeting lithography pattern placement requirements at the nanometer order and delivery deadlines.
Key Point
Key Point
- Consistent, high-volume production
- Ultra-precision machining for nanometer accuracy
- Fast turnaround with strict quality control
Simplified Sourcing for
the New Energy Industry
Our aviation industry parts manufacturing capabilities have been verified by many listed companies. We provide a variety of manufacturing processes and surface treatments for aerospace parts including titanium alloys and aluminum alloys.
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Browse our complete selection of CNC machined semiconductor components, crafted for durability and ultra-tight tolerances. From precision tooling and fixture parts to vacuum chambers and wafer handling systems, we deliver solutions tailored to advanced semiconductor production.
Photolithography Reticle Holders Machining Capabilities
Our ultra-precision grinding and lapping machinery, along with skilled machinists involved in photolithography, provide Reticle Holders CNC Machining for Photolithography Systems. Integrated electrostatic reticle chuck assemblies, mechanical clamps, and pellicle frame interfaces with flatness tolerances dictate engagement for pattern placement accuracy, thermal stability, and handling masks free of particles in the photolithography system.
For reticle positioning, contamination control, and control of aligners, interferometric measurements of flatness, and particle counting, we provide ultra-precision surface grinding, lapping, and thermal material processing in cleanroom assembly. Each reticle holder is machined in different materials combined for lightweight, high stability, and ideally suited for virtually all photolithography system illumination and expansion.
For reticle positioning, contamination control, and control of aligners, interferometric measurements of flatness, and particle counting, we provide ultra-precision surface grinding, lapping, and thermal material processing in cleanroom assembly. Each reticle holder is machined in different materials combined for lightweight, high stability, and ideally suited for virtually all photolithography system illumination and expansion.
Aerospace
Materials & Finishes
Materials
We provide a wide range of materials, including metals, plastics, and composites.
Finishes
We offer superior surface finishes that enhance part durability and aesthetics for applications requiring smooth or textured surfaces.
Specialist Industries
you are welcome to emphasize it in the drawings or communicate with the sales.
Materials for Reticle Holders
Reticle Holders Machining for Photolithography Systems requires various materials, which is available in our CNC machine shop. Supporting rapid prototyping for ultra-precision photomask handling manufacturing with nanometer-level dimensional stability, we incorporate over 10 ultra-low expansion materials along with cleanroom-compatible alloys.
High machinability and ductility. Aluminum alloys have good strength-to-weight ratio, high thermal and electrical conductivity, low density and natural corrosion resistance.
Price
$ $ $
Lead Time
< 7 days
Tolerances
Down to ±0.003 mm
Max part size
3000*2200*1100 mm
Min part size
2*2*2 mm
Steel is a strong, versatile, and durable alloy of iron and carbon. Steel is strong and durable. High tensile strength, corrosion resistance heat and fire resistance, easily molded and formed. Its applications range from construction materials and structural components to automotive and aerospace components.
Price
$ $ $ $ $
Lead Time
< 10 days
Tolerances
Down to ±0.001 mm (routing)
Max part size
3000*2200*1100 mm
Min part size
2*2*2 mm
Stainless steel alloys have high strength, ductility, wear and corrosion resistance. They can be easily welded, machined and polished. The hardness and the cost of stainless steel is higher than that of aluminum alloy.
Price
$ $ $
Lead Time
< 7 days
Tolerances
Down to ±0.005 mm
Max part size
3000*2200*1100 mm
Min part size
2*2*2 mm
Titanium is an advanced material with excellent corrosion resistance, biocompatibility, and strength-to-weight characteristics. This unique range of properties makes it an ideal choice for many of the engineering challenges faced by the medical, energy, chemical processing, and aerospace industries.
Price
$$$
Lead Time
< 10 days
Tolerances
Down to ±0.005 mm
Max part size
3000*2200*1100 mm
Min part size
2*2*2 mm
Highly resistant to seawater corrosion. The material’s mechanical properties are inferior to many other machinable metals, making it best for low-stress components produced by CNC machining.
Price
$ $ $ $ $
Lead Time
< 10 days
Tolerances
Down to ±0.005 mm
Max part size
3000*2200*1100 mm
Min part size
2*2*2 mm
Brass is mechanically stronger and lower-friction metal properties make CNC machining brass ideal for mechanical applications that also require corrosion resistance such as those encountered in the marine industry.
Price
$$$
Lead Time
< 10 days
Tolerances
Down to ±0.005mm
Max part size
3000*2200*1100 mm
Min part size
2*2*2 mm
Few metals have the electric conductivity that copper has when it comes to CNC milling materials. The material’s high corrosion resistance aids in preventing rust, and its thermal conductivity features facilitate CNC machining shaping.
Price
$$$
Lead Time
< 10 days
Tolerances
Down to ±0.005 mm
Max part size
3000*2200*1100 mm
Min part size
2*2*2 mm
Due to the low mechanical strength of pure magnesium, magnesium alloys are mainly used. Magnesium alloy has low density but high strength and good rigidity. Good toughness and strong shock absorption. Low heat capacity, fast solidification speed, and good die-casting performance.
Price
$ $ $ $
Lead Time
< 7 days
Tolerances
Down to ±0.005 mm
Max part size
3000*2200*1100 mm
Min part size
2*2*2 mm
Iron is an indispensable metal in the industrial sector. Iron is alloyed with a small amount of carbon – steel, which is not easily demagnetized after magnetization and is an excellent hard magnetic material, as well as an important industrial material, and is also used as the main raw material for artificial magnetism.
Price
$ $ $ $ $
Lead Time
< 10 days
Tolerances
Down to ±0.005 mm
Max part size
3000*2200*1100 mm
Min part size
2*2*2 mm
Zinc is a slightly brittle metal at room temperature and has a shiny-greyish appearance when oxidation is removed.
Price
$ $ $ $ $
Lead Time
< 10 days
Tolerances
Down to ±0.005 mm
Max part size
3000*2200*1100 mm
Min part size
2*2*2 mm
Let’s Build Something Great, Together
FAQs: Reticle Holders for Photolithography Applications
Photograph reticle holders are ultra-precision mounting devices that mount and position photomasks (reticles) while they are being exposed in lithography steppers and scanners for the chip patterns of semiconductors. These holders include electrostatic reticle chucks that use the coulombic force as the non-contact clamp. 12 inch reticles, with the mechanical edge clamps that are spring-loaded, Vacuum holders with porous ceramics that are distributed under supplied suction as well as pellicle frame interfaces that support 6 millimeters protective envelopes with membranes that are above the reticle surface. There are stage-integrated holders for step-and-scan systems, specialty holders, and pellicle frame interfaces that are EUV reticle stage for 13.5nm wavelenght lithography, immersion lithography compatible designs and multi patterns alignment systems with alignment accuracy of above 2nm for the overlay. There are temperature controlled holders are with ±0.01°C stability.
The near-zero thermal expansion coefficient (under 0.02 ppm/K) of Zerodur glass-ceramic, coupled with its lower glass-ceramic expansion under thermal cycling, makes it reliable for reducing temperature pattern placement errors and maintaining close dimensional stability and flattening through thermal cycling. Zerodur also has adequate stiffness and dimensional stability for optical systems. Ultra-Low Expansion (ULE) glass performs better with thermal expansion and optical quality. ULE glass has also maintained superior optical quality and precision photolithography. Invar 36 provides low thermal expansion 1.2 ppm/K which is adequate for many applications, excellent machinability, magnetic properties for electrostatic chuck integration, and cost-effectiveness. Titanium alloys provide lightweight and low thermal expansion (8.6 ppm/K) which is manageable with active temperature control, and cleanroom compatibility. Carbon fiber composites provide tailored thermal expansion to match reticle substrate. composites also provide ultimate weight reduction and vibration dampening
Ultra-precision surface grinding achieves reticle support surface flatness within 0.0001 inches across 6-inch square area and total thickness variation below 0.0003 inches. Precision lapping produces mirror-smooth surfaces with Ra below 0.05 microns for optical-grade finish and minimal particle adhesion. Diamond machining processes ceramics and glass materials. CNC milling creates mounting features, alignment references, and cooling channels. Coordinate drilling produces vacuum ports and clamping mechanism interfaces with position accuracy within ±0.002 inches. Wire EDM cuts precision slots for edge clamps. Electropolishing on metal holders reduces particle generation. All critical operations performed in ISO Class 3 cleanrooms preventing contamination.
We achieve reticle support surface flatness within 0.0001 inches across 6-inch square area for uniform mask clamping preventing pattern distortion, parallelism within 0.0003 inches between top and bottom surfaces ensuring perpendicular illumination, position reference accuracy within ±0.001 inches for stage alignment, surface finish below 0.05 Ra microns on lapped surfaces minimizing particle adhesion and light scattering, clamping force uniformity within 5 percent preventing reticle stress, and thermal stability maintaining dimensional changes below 10 nanometers per degree Celsius.
Definitely. We conduct rapid prototyping for lithography tools and for lower-volume lithography-IC test tools and hold production at advanced research test tool and pilot lines producing 5 to 50 holder sets. Additionally, we conduct medium-volume production for commercial lithography systems where we produce hundreds of holders annually. We perform all the required inspections such as full dimensional inspections for accuracy, flatness inspections using laser interferometry, and the thermal stability tests of the structures by cycling the holders between 20 to 25 degrees. Other tests include the generation of particles tested for SEMI standards with adder counts below 0.01 and the certified thermal expansion of the holders. We also check and certify thermal expansion of the holders.
Options available include precision lapping which results in an Ra value of under 0.05 microns and a flatness of 0.0001 inches for reticle support surfaces, super-polishing of ceramic holders to an Ra of under 0.01 microns for EUV applications to minimize light scattering, electropolishing of metals at an Ra of 0.2 microns which removes surface contamination and passes electropolishing, hard anodizing of aluminum for corrosion and wear resistance, and advanced techniques which involve plasma cleaning that removes organic contamination to surface cleanliness of atoms at 10^12 per sq cm, anti-reflective coatings to minimize stray light, and vacuum baking to reduce outgassing for compatibility of systems to a vacuum
Yes, all components are produced and documented per ISO 9001 quality management systems, with all suited and tested for dimensional checks, design acceptance and resolved flatness using interferometry, thermal stability between 20 and 25 degrees confirmed by cycles and generation of particles per SEMI E52 standards, and to advanced node photolithography equipment standards patterned placement accuracy with 2 nanometers of control at contours. We certified the control of contaminants to support defect densities, the holders to exceeding 100,000 exposure cycles and the particles generated to be below 0.01 defects per square centimeter.
For CNC machined reticle holders, the lead time is 20 to 28 business days for the standard Invar, and titanium holders, which includes machining, lapping, and qualification in a cleanroom. In comparison, ultra-low expansion ceramic holders (Zerodur/ULE) require 10 to 14 weeks on account of his processing of the material and thermal characterization. As such, prototype holders for flatness testing can be achieved in 14 to 18 days and this allows for rapid development of lithography systems.
We create ultra-flat holders requiring flatness to within 50 nanometers across full aperture for EUV lithography, temperature-controlled holders for overlay precision dipped below 2 nanometers for ±0.01°C stability, high-throughput holders for reticle exchange times of less than 5 seconds, pellicle-compatible interfaces for protective membranes to be attached without vibrations, large-format holders for advanced packaging lithography to handle greater than 9-inch reticles, dual-reticle holders for double-patterning, and custom vibration-isolated holders designed to meet sub-nanometer stability, vibration isolation integrated to electrostatic chucks for active control of clamping force, adaptive holders for active surface control varied reticle flatness compensation and control significantly beyond reticle control.
Exceptional flatness within 0.0001 inches across reticle support surface guarantees uniform contact and prevents pattern distortion where 1 micron reticle bow causes 4 nanometer overlay error at wafer level and degrading device yield on advanced nodes < 5 nanometers. Use of materials with ultra-low thermal expansion coefficients < 0.02 ppm per Kelvin prevents dimensional changes > 10 nanometers and temperature changes during exposure. This maintains pattern placement accuracy within 2 nanometers for multi-patterning processes. Ultra-smooth lapped surfaces with Ra < 0.05 microns minimize particle adhesion and achieve adder counts < 0.01 particles per exposure to prevent killer defects on critical layers eliminating excessive particles from marked roughed surfaces. Adequate stiffness prevents vibration-induced pattern blur. This maintains the image quality with modulation transfer function > 80 percent. Precise alignment reference features support reticle-to-stage positioning within 10 nanometers to meet overlay budgets on advanced logic and memory devices. Material selection and reticle thermal expansion balance stress distortion and select distortion.
Reliable handling of photomasks is supported by the precise manufacturing process required for semiconductor lithography with an astounding accuracy within 2 nanometers, 3-sigma overlay performance under 1.5 nanometers for multi-patterning, and high levels of contamination control with defect densities under 0.01 defects per square centimeter. Furthermore, the photomask has a service life of over 100,000 exposure cycles which translates to several years of high-volume manufacturing in advanced logic fabrication facilities for 5 nanometer, 3 nanometer, and 2 nanometer technology nodes, including advanced 2 nanometer technology.
Reliable handling of photomasks is supported by the precise manufacturing process required for semiconductor lithography with an astounding accuracy within 2 nanometers, 3-sigma overlay performance under 1.5 nanometers for multi-patterning, and high levels of contamination control with defect densities under 0.01 defects per square centimeter. Furthermore, the photomask has a service life of over 100,000 exposure cycles which translates to several years of high-volume manufacturing in advanced logic fabrication facilities for 5 nanometer, 3 nanometer, and 2 nanometer technology nodes, including advanced 2 nanometer technology.
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