
| Rigid Side (R) | Flex Side (F) | Bond-Ply |
| FR4 Tg 130–150 °C | PI 25 µm + RA copper | Acrylic (1–2 mil) |
| High-Tg FR4 >170 °C | PI 25 µm + RA copper | Low-flow epoxy |
| Rogers RO4350B | LCP 25 µm + RA copper | No-flow, heat-press |
| PI laminate Tg≥250 °C | PI 25 µm + RA copper | PI hot-melt |
| Al-MCPCB 1–3 mm | PI 12.5 µm + RA copper | Thermally-conductive epoxy 1–5 W/m·K |
| Cu-MCPCB 0.5–3 mm | PI 12.5 µm + RA copper | Ag-sinter paste |
| Modified low-CTE PI | PI 25 µm + RA copper | Low-flow epoxy |
| Rigid Zone (R) | Flex Zone (F) | Bond Method | Surface Finish (R→F) | Features / Apps |
| FR4-Tg150 | PI 25 µm+RA Cu | Acrylic | ENIG → OSP | Phone hinge, low-cost high-rel |
| FR4-Tg170 | PI 25 µm+RA Cu | Epoxy low-flow | ENEPIG → Immersion Tin | Auto ECU, lead-free 260 °C |
| Rogers RO4350B | LCP 25 µm+RA Cu | Adhesive-less heat-press | Immersion Ag → OSP | 5G mmWave, loss <0.004 |
| High-Tg PI laminate | PI 25 µm+RA Cu | PI hot-melt | ENEPIG → Immersion Au fingers | Aero engine, all-PI 300 °C |
| Al-MCPCB 1.5 mm | PI 12.5 µm+RA Cu | Thermally-conductive epoxy | Anodize + ENIG | LED bar, 1–5 W/m·K |
| Cu-MCPCB 1 mm | PI 12.5 µm+RA Cu | Ag-sinter | Electroless Ni + hard gold fingers | Laser diode, 380 W/m·K |
| Modified low-CTE PI | PI 25 µm+RA Cu | Low-flow epoxy | ENIG → OSP | Auto BMS, –55~125 °C cycles |
Upload your Gerber files and get a quote within 24 hours. Our engineers review your design to avoid misunderstandings and offer competitive pricing.
We strictly control materials, processes, surface finishes, AOI, and flying probe tests to ensure consistent quality from prototype to mass production.
With advanced equipment and a professional team, we prioritize your order based on complexity and urgency.
We provide full technical support from quote to delivery. We respond quickly to any questions until you receive your PCBs and are fully satisfied.

