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HF & HS PCB Manufacturing
With low loss, low dispersion, and high impedance accuracy, High Frequency & High Speed PCBs are widely used in 5G base-station AAU, 77 GHz automotive radar, 800 G switches, satellite communications, etc.
- Up to 40 layers
- Maximum panel size: 900×700 mm
- Dimensional tolerances down to ±0.05mm
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Our High Frequency & High Speed PCB Capabilities
Zintilon is committed to providing advanced High Frequency & High Speed PCB manufacturing services to global users, supporting prototyping to small-batch production. From cutting to packaging, we ensure efficient and reliable PCB manufacturing solutions.
High Frequency & High Speed PCB Materials
| Material Family / Typical Grade | Dk@10 GHz | Df@10 GHz | Strengths & Limits | Typical Scenario |
| Low-loss FR-4 (Megtron-6, I-Tera MT40) | 3.4–3.7 | 0.003–0.004 | Co-pressed with FR4, cost +30 % | 800 G switches, 5G small cells |
| Hydrocarbon ceramic (Rogers RO4835) | 3.48 | 0.0037 | Anti-oxidation, Tg 200 °C | RF PAs, automotive radar |
| Modified PPE/PPO (Megtron-7, S7/S8) | 3.4 | 0.002 | Multi-layer compatible, Tg 250 °C | AI servers, 56 G SerDes |
| PTFE ceramic (Rogers RO4350B, RT5880) | 2.2–3.5 | 0.0009–0.0015 | Lowest loss, needs plasma desmear | 77 GHz radar, mmWave antennas |
| LCP Film | 2.9 | 0.002 | Bendable, low moisture absorption | mmWave FPC, foldable antennas |
High Frequency & High Speed PCB Surface Finishes
| Process | Insertion Loss @10 GHz (dB/inch) | Skin-Effect Impact | Solderability | Storage Life | Cost | Freq. Range | Reliability / Risk | Remarks |
| OSP | ≈0.02 (same as bare Cu) | Minimal | Good | 3–6 mo | Lowest | ≥10 GHz mmWave | Drops after multiple reflows | Ultra-high-speed favorite |
| Nano-barrier + 50 nm Au | ≈0.02 (same as bare Cu) | Minimal | Excellent | ≥12 mo | Med-High | 0–100 GHz | No nickel brittleness | Emerging nickel-free |
| DIG (Direct Immersion Gold) | ≈0.02 | Minimal | Excellent | ≥12 mo | Highest | ≥10 GHz | Brittle solder, high cost | Cost-no-object |
| EPIG/EPAG | 0.03–0.04 | Low (no Ni) | Excellent | ≥12 mo | High | 1–30 GHz | Palladium brittleness | Noble-metal, no Ni |
| Immersion Ag (ImAg) | 0.03–0.05 | Low | Excellent | 6–12 mo | Medium | 1–20 GHz | Sulfur tarnish | 5G RF common |
| Immersion Tin (ImSn) | 0.05–0.08 | Medium | Excellent | 3–6 mo | Low-Med | 1–10 GHz | IMC growth, long-term brittle | Low-cost HF |
| ENIG | 0.10–0.15 | High (nickel) | Excellent | ≥12 mo | Medium | <1 GHz | Black-pad, nickel brittle | Avoid >6 GHz |
| Selective Hard Gold | 0.12–0.20 | High | Poor (needs flux) | ≥24 mo | High | Edge fingers only | Wear/oxidation | Not on signal lines |
Why Choose Our
High Frequency & High Speed PCB Services?
One-on-One Quotation
Simply upload your .gbr files and receive a quotation within 24 hours. Our professional engineers will analyze your design, avoid misunderstandings, and communicate with you to provide a reasonable price.
High-Quality Production
We maintain a rigorous attitude toward materials, processes, surface finishes, AOI, and flying-probe testing, ensuring consistent high quality from prototype to batch production. We promise a parts-quality check before delivery.
Fast Delivery
Equipped with advanced machinery and a professional engineering team to ensure fast delivery. We prioritize orders based on requirements and complexity. Customized delivery solution is also available to tailored to your needs.
Instant Communication
We provide each customer with full technical support from quotation to delivery. We reply to any questions quickly until you confirm receipt of satisfactory High Frequency & High Speed PCBs.
High Frequency & High Speed PCB Standards
Zintilon ensures quality through our Rigid PCB design and manufacturing standards from design to delivery by follow up IPC standards (IPC-2221C, IPC-6012E) to ensure manufacturability and reliability.
Signal-Integrity Limits
Spec
Insertion-loss budget
≤0.25 dB/inch @ 10 GHz for 56 G PAM4
Return-loss
≤–20 dB (S11) up to Nyquist
Intra-pair skew
≤1 ps (≈0.5 mm) for 112 G PAM4
Via stub
≤0.025 mm for 28 G+; back-drill or blind-via mandatory
High Frequency & High Speed PCB Guidelines
Ensure precise tolerances, select appropriate materials, maintain clear CAD designs, and follow IPC for best results. Zintilon delivers accuracy, quality, and consistency in every PCB prototype.
Dimension
Key Rule
Quantitative/Empirical
Source/Notes
Stack-up
Key Rule Symmetrical, tight P-G coupling
Quantitative/Empirical Signal-to-plane 4–8 mil
Source/Notes Reduces warpage, low loop inductance
Material choice
Key Rule Low loss, stable Dk, low moisture
Quantitative/Empirical ≥10 GHz: Rogers/Megtron6, Df≤0.004
Source/Notes Dk tolerance ±2 %
Impedance control
Key Rule 50 Ω single, 85–100 Ω diff
Quantitative/Empirical Width tol. ±8 %, final ±5 Ω
Source/Notes 2-D field solver, include solder mask
Reflection control
Key Rule Impedance continuous everywhere
Quantitative/Empirical Return loss ≤ –20 dB
Source/Notes No 90°, use arcs/45°
Stub control
Key Rule Back-drill or short-stub routing
Quantitative/Empirical Stub ≤0.15λ; ≥25 Gbps ≤0.3 mm
Source/Notes 5G/77 GHz radar ≤2 mil
Crosstalk control
Key Rule 3 W rule, ground via fence
Quantitative/Empirical Gap ≥2–3× line width
Source/Notes Guard traces & via walls
Differential pairs
Key Rule Matched length, gap, same layer
Quantitative/Empirical Intra-pair skew ≤20 mil (≤1 ps)
Source/Notes Serpentine spacing ≥2 W
Timing/skew
Key Rule Multi-channel skew ≤5 ps
Quantitative/Empirical Inter-pair length diff ≤0.5 mm
Source/Notes PCIe5/DDR5 cal. w/ sim
Via optimization
Key Rule Few, small, same-layer exit
Quantitative/Empirical High-speed ≤2 vias, diameter ≤0.3 mm
Source/Notes Ground via companions, back-drill
Power integrity
Key Rule Decap radius ≤1/10 λ
Quantitative/Empirical 0.1 µF + 4.7 µF, ≤5 mm loop
Source/Notes P-G plane cap, target Z ≤10 mΩ
EMC/shielding
Key Rule HF blocks isolated & shielded
Quantitative/Empirical HF-LF spacing ≥15 mm
Source/Notes Split ground but not return path
Thermo-mechanical
Key Rule Copper balance, low-stress stack
Quantitative/Empirical 150 °C bake after back-drill; step drill thick boards
Source/Notes Ceramic/metal cores need step parameters
Manufacturability
Key Rule Line/space ≥2 mil (HDI)
Quantitative/Empirical Back-drill depth tol. ±0.025 mm
Source/Notes Align with fab capability, minimize back-drill types
Our Custom High Frequency & High Speed PCB for Various Industrial Applications
Thanks to core advantages such as 50 % lower insertion loss, ±5 % impedance accuracy, and back-drill stubs ≤0.05 mm, High Frequency & High Speed PCBs are now widely used in 5G base-station AAUs, 77 GHz automotive radar, 800 G switches, satellite communications, and more.
High Frequency & High Speed PCB FAQs
Project lead time and cost depend on its complexity. Zintilon will spare no effort to provide the most competitive prices and the fastest delivery time.
We understand that clients may need to make some adjustments after receiving the sample. Minor modifications can be done free of charge. However, if the modifications are substantial, we will need to reassess the price and delivery time.
We accept T/T and PayPal payments.
Got any more questions?
Ultimate Guide
to High Frequency & High Speed PCB
to High Frequency & High Speed PCB
High Frequency & High Speed PCB
Various and Robust High Frequency & High Speed PCB Services
Prototype
Prototyping
From Gerber files to circuit boards, our professional engineering team provides you with the highest quality HF & HS PCB manufacturing services. We meticulously control every detail of the process, including drilling, electroplating, and AOI, ensuring precise control over trace spacing, thickness, and panel dimensions. We are committed to providing you with the most reliable HF & HS PCBs.
- Complete production line
- Professional engineering support
- 10+ years‘ manufacturing experience
Production
Production
We have our own production lines and a robust manufacturing network. From HF & HS PCB design, engineering, and manufacturing, we have sufficient capacity to provide you with professional and fast delivery services, whether for small or large batches. We spare no effort in providing consistent mass production services for your products.
- Strong supply chain team
- Competitive pricing
- One-stop service from design to delivery
Let’s Build Something Great, Together
