ZTL TECH is now Zintilon. We’ve updated our name and logo for a fresh start. Check Now
HDI PCB & PCB Vias Manufacturing
We use laser micro-vias and any-layer interconnection technology, with line width/spacing ≤ 40 µm, blind via aspect ratio ≤ 1:1, and up to 13 stacks (13 steps), achieving over 3× routing density compared to through-hole boards in the same area for ultra-high-density packaging and high-speed signal transmission.Supports multiple core materials.
- Up to 40 layers
- Maximum panel size: 900×700 mm
- Dimensional tolerances down to ±0.05mm
Start a new PCB Quote
Please compress all .gbr files before uploading
All uploads are secure and confidential
Our HDI PCB / PCB Vias Manufacturing Capabilities
HDI PCB / PCB Vias are widely used in 5G base station AAU, 77 GHz automotive radar, 800 G switches, and satellite communications. Zintilon is committed to providing advanced HDI PCB / PCB Vias manufacturing services to global users, supporting prototyping to small-batch production of HDI PCB / PCB Vias. From cutting to packaging, we ensure efficient and reliable HDI PCB / PCB Vias manufacturing solutions.
HDI PCB & PCB Vias Materials
Pick the stack-up that matches your temperature → frequency → thermal → cost targets.
| Material/System | Typical Thickness | Key Performance | Laser Drilling Suitability | One-Line Summary |
| FR4 Build-up (IPC-4104 /21-/25) | 50–100 µm | Tg 150–170 °C, Dk≈4.2 | ≤50 µm glass, laser drillable | Lowest-cost 1+N+1 HDI |
| RCC (Resin-Coated Copper) | 40–80 µm | Glass-free, Dk≈4.0, Df≈0.015 | Excellent (no glass blocking) | First choice for laser blind vias, phone mainboard |
| LCP Film | 25–50 µm | Dk=2.9, Df=0.002@10 GHz | Excellent (melts under laser) | mmWave antenna, high-speed SerDes |
| PI Build-up Film | 25–50 µm | Tg≥250 °C, 300 °C solderable | Good (low glass) | Aerospace/medical high-reliability HDI |
| BT/Epoxy Blend | 60–100 µm | Tg 180–220 °C, low Z-CTE | Thin glass, laser drillable | Chip package substrates (FC-BGA) |
HDI PCB & PCB Vias Capabilities
| Process Parameter | Sample | Batch |
|---|---|---|
| Layers | 50L | 40L |
| Finished Board Thickness | 0.2-18.0 mm | 0.3-10.0 mm |
| Board Thickness Tolerance | ±8% | ±8% |
| Min Line Width/Spacing | 1.5 mil/1.5 mil | 2 mil/2 mil |
| Min Hole-to-Line Spacing | 5 mil | 5 mil |
| Max Processing Size | 1200 mm*600 mm | 570 mm*760 mm |
| Min Finished Size | 5 mm*5 mm | 50 mm*50 mm |
| Copper Thickness | 1/3 oz-12 oz | 1/3 oz-8 oz |
| Layer-to-Layer Alignment Accuracy | 0.8 mil | 1 mil |
| Min Through-Hole Diameter | 0.075 mm | 0.1 mm |
| Min Blind-Hole Diameter | 0.05 mm | 0.075 mm |
| Max Aspect Ratio | 35:1 | 30:1 |
| Etching Tolerance | ±10%/±0.8 mil | ±10%/±1 mil |
| Min Solder Mask Bridge | 2 mil | 3 mil |
| Impedance Control Tolerance | ±5% | ±7% |
| HDI Order | 8th order | 5th order |
| Surface Finishing Process | ENIG, E-Gold, HASL, Ni-Pd-Au, Thick E-Gold, ImSn, ImAg, OSP, etc. | ENIG, E-Gold, HASP, Ni-Pd-Au |
Why Choose Our
HDI PCB / PCB Vias Services?
One-on-One Quotation
Simply upload your .gbr files and receive a quotation within 24 hours. Our professional engineers will analyze your design, avoid misunderstandings, and communicate with you to provide a reasonable price.
High-Quality Production
We maintain a rigorous attitude toward materials, processes, surface finishes, AOI, and flying-probe testing, ensuring consistent high quality from prototype to batch production. We promise a parts-quality check before delivery.
Fast Delivery
Equipped with advanced machinery and a professional engineering team to ensure fast delivery. We prioritize orders based on requirements and complexity. Customized delivery solution is also available to tailored to your needs.
Instant Communication
We provide each customer with full technical support from quotation to delivery. We reply to any questions quickly until you confirm receipt of satisfactory HDI PCB / PCB Vias boards.
HDI PCB & PCB Vias Standards
Zintilon ensures quality through our Rigid PCB design and manufacturing standards from design to delivery by follow up IPC standards (IPC-2221C, IPC-6012E) to ensure manufacturability and reliability.
Item
Recommended
Basis
Laser blind diameter
Economical Window 50–100 µm
High-End Window IPC-4104 /30 series
Line/space
Economical Window ≥25 µm (proto), ≥40 µm (mass)
High-End Window IPC-2226
Back-drill stub
Economical Window ≤5 µm (high-speed nets)
High-End Window High-speed spec
Lam cycles
Economical Window ≤3 (3+N+3 practical)
High-End Window Any-layer HDI limit
HDI PCB & PCB Vias Guidelines
Ensure precise tolerances, select appropriate materials, maintain clear CAD designs, and follow IPC for best results. Zintilon delivers accuracy, quality, and consistency in every PCB prototype.
Parameter
Economical Window
High-End Window
Line/Space
Economical Window ≥40 µm (1 mil)
High-End Window ≥25 µm (0.8 mil)
Copper thickness
Economical Window 12 µm (½ oz)
High-End Window 9 µm (⅓ oz) or 5 µm (UTC)
Corner
Economical Window 45° + arc R≥0.15 mm
High-End Window Arc R≥0.1 mm
Differential impedance
Economical Window ±10 %
High-End Window ±5 % (112 G PAM4)
Our Custom HDI / PCB Vias for Various Industrial Applications
HDI PCB / laser-blind & buried-via boards (up to 13 steps) are now in volume production across many industries, driven by one common formula: “space-cramped + high-speed/high-frequency + high reliability”. AI servers go any-layer; mmWave needs low-loss dielectrics, car power wants heavy copper, medical implants insist on ultra-thin cores, and aerospace asks for full-temp ceramics. You’ll spot the right HDI / blind-buried via solution for every sector.
HDI PCB / PCB Vias FAQs
Project lead time and cost depend on its complexity. Zintilon will spare no effort to provide the most competitive prices and the fastest delivery time.
We understand that clients may need to make some adjustments after receiving the sample. Minor modifications can be done free of charge. However, if the modifications are substantial, we will need to reassess the price and delivery time.
We accept T/T and PayPal payments.
Got any more questions?
Ultimate Guide
to HDI PCB & PCB Vias
to HDI PCB & PCB Vias
HDI PCB & PCB Vias Manufacturing
Various and Robust HDI PCB & PCB Vias Services
Prototype
Prototyping
From Gerber files to circuit boards, our professional engineering team provides you with the highest quality HDI PCB & PCB vias manufacturing services. We meticulously control every detail of the process, including drilling, electroplating, and AOI, ensuring precise control over trace spacing, thickness, and panel dimensions. We are committed to providing you with the most reliable HDI PCB & PCB viass.
- Complete production line
- Professional engineering support
- 10+ years‘ manufacturing experience
Production
Production
We have our own production lines and a robust manufacturing network. From HDI PCB & PCB vias design, engineering, and manufacturing, we have sufficient capacity to provide you with professional and fast delivery services, whether for small or large batches. We spare no effort in providing consistent mass production services for your products.
- Strong supply chain team
- Competitive pricing
- One-stop service from design to delivery
Let’s Build Something Great, Together
