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FC PCB Assembly
FC PCB Assembly refers to a board-level assembly service that centers on Flip-Chip technology. It involves directly soldering the electrical side of the chip face-down onto the substrate pads, supplemented by processes such as underfilling, laser ball placement, and BGA packaging. This technology achieves "the shortest interconnection, the lowest parasitics, and the highest density".
- Maximum panel size 54 inches
- Maximum panel thickness 0.450 inches
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Our FC PCB Assembly Service Capabilities
Zintilon Technology is committed to providing advanced FC PCB assembly services to global users, supporting FC PCB assembly from prototype production in the product R&D stage to small-batch manufacturing. From printing to assembly, we ensure to deliver efficient and reliable FC PCB assembly solutions for you.
FC PCB Assembly Materials
| Layer | Recommended Model/Specification | Key Parameters | Remarks |
|---|---|---|---|
| Chip Bump | High-lead 95Pb5Sn (C4) or SAC305 micro-bump | Diameter: 60–100 µm; Height: 50–80 µm; Pitch: 80–150 µm | High-lead bumps have a melting point of 320°C and can withstand high temperatures in subsequent processes; lead-free bumps require vacuum reflow to prevent voids |
| UBM (Under-Bump Metallization) | Ti/Cu/Ni/Au or Al/Ni(V)/Cu | Total thickness: 0.5–1.0 µm; Ni layer: 0.3 µm (prevents diffusion) | Determines bump shear strength ≥ 6 g/bump (per JEDEC JESD22-B117) |
| Carrier/Substrate | ① BT Resin Core (ABF GX-13); ② Coreless + Build-up | Dk: 3.4@10 GHz; Df: 0.004; CTE: 11–13 ppm | Minimum line width/spacing: 12 µm/12 µm |
| Dielectric Build-up Layer | ABF GX-92 or Panasonic R-1515 | Thickness: 5 µm; Laser-drilled hole diameter: 40 µm | Compatible with 40 µm laser vias |
| Solder Mask | Photosensitive Black LDI Ink | Thickness: 15–20 µm; Resolution: 25 µm; Withstands 288°C for 10 s | Prevents flux from contaminating bumps |
FC PCB Assembly Surface Finishes
| Process | Thickness | Advantages in FC | Limitations |
|---|---|---|---|
| ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) | Ni 3–5 µm + Pd 0.05–0.1 µm + Au 0.03–0.05 µm | Compatible with high-lead/lead-free bumps; suitable for both wire bonding and soldering; resistant to black nickel | Highest cost; requires palladium thickness control |
| ENIG (Electroless Nickel Immersion Gold) | Ni 3–5 µm + Au 0.05 µm | Suitable for conventional FC-BGA; flatness < 0.3 µm | Risk of black nickel; prone to embrittlement in high-lead reflow |
| Immersion Tin (ImSn) | 0.8–1.2 µm | Compatible with SAC bumps; thin interfacial IMC; low voids | Storage life: 6 months; prone to tin whisker growth |
| OSP (Organic Solderability Preservative) | 0.15–0.3 µm | Ideal for RF-FC hybrid boards; minimal skin effect loss | Not resistant to multiple high-temperature cycles; limited to one-time reflow |
Why Choose Our
FC PCB Assembly Service?
One-on-One Quotation
Simply upload your .gbr file, and you will receive a quotation feedback within 24 hours. Our professional engineers will analyze your design to avoid misunderstandings, communicate with you, and provide a reasonable price.
High-Quality Assembled
We maintain a rigorous and responsible attitude towards materials, processes, surface treatments, A.O.I (Automated Optical Inspection), and flying probe testing, ensuring consistent high quality from prototype production to mass production.
Fast Delivery
Equipped with advanced machinery and a professional quotation team to ensure fast delivery. We prioritize orders based on order requirements and complexity. Cutomized delivery sulution is also available.
Real-Time Communication
For your benefit, we provide full-process technical support for each customer from quotation to delivery. We will respond quickly to any of your questions until you confirm that you have received satisfactory FC PCB Assembly products.
FC PCB Assembly Standards
We follow the tolerance standards of ISO 2768 (medium grade, fine grade) and ISO 286 (grade 8, 7, 6). You are welcome to emphasize it in the drawings or communicate with the sales for higher precision needs. We follow ISO2768m by default in the absence of special requirements.
Item
Subitem
Spec
Placement Accuracy
Value/Requirement Placer accuracy
Source/Remarks ±10 µm @ 3σ (Cpk≥1.33); ±5 µm for 01005 flip-chip
Value/Requirement Flux dip
Source/Remarks film 20–40 µm, cover ≥75 % bump height
Value/Requirement Self-alignment window
Source/Remarks mis-alignment ≤50 % pad width still pulls-in
Critical Dimensions & Alignment
Value/Requirement Solder-mask opening
Source/Remarks Ø = Cu pad + 20–30 µm, reg. accuracy ±12 µm
Value/Requirement Warpage
Source/Remarks ≤0
FC PCB Assembly Guidelines
Ensure precise tolerances, select appropriate materials, maintain clear CAD designs, and follow toolpath optimization for best results. Zintilon delivers accuracy, quality, and consistency in every machined part.
Item
Value/Requirement
Source/Remarks
Bump Pitch
Value/Requirement Minimum 80 µm (mass production); 50 µm (laboratory)
Source/Remarks JEDEC JESD22-B117
Bump Diameter
Value/Requirement 60–100 µm (1:1.2 ratio with pitch)
Source/Remarks Shear strength ≥ 6 g/bump
Carrier Pad
Value/Requirement NSMD (Non-Solder-Mask-Defined); opening 25 µm larger than copper pad
Source/Remarks Reduces stress concentration
Solder Mask Opening (SRO)
Value/Requirement Ø = Copper pad + 20–30 µm; alignment accuracy ±12 µm
Source/Remarks Prevents solder mask from covering bumps
Underfill
Value/Requirement Capillary epoxy resin; CTE: 26–30 ppm; Tg: 120–140°C
Source/Remarks Filling time < 30 s; voids < 5%
Reflow Profile (High-Lead C4)
Value/Requirement Peak temperature: 320–350°C; N₂ atmosphere; oxygen < 50 ppm
Source/Remarks Prevents oxidative voids
Reflow Profile (Lead-Free SAC)
Value/Requirement Peak temperature: 240–250°C; vacuum stage: 5 mbar/10 s
Source/Remarks Void rate < 1%
Warpage
Value/Requirement Carrier warpage after reflow ≤ 0.3% (FC-BGA)
Source/Remarks Prevents bump cold soldering
Test Pad
Value/Requirement Reserve 0.2 mm × 0.2 mm copper window on the carrier periphery
Source/Remarks Shared by ICT (In-Circuit Test) and X-Ray
Our Custom FC PCB Assembly Service for Various Industrial Applications
FC PCB Assembly (Flip-Chip PCB Assembly) leverages four core advantages: "high-density interconnection, low parasitic parameters, high heat dissipation efficiency, and strong mechanical stability". It has become the "high-performance core carrier" for high-end electronic devices, covering key application scenarios from precision sensing to cutting-edge computing power.
FC PCB Assembly FAQs
Our maximum CNC machining part size is 3000 mm x 2200 mm x 1100 mm.
Our CNC machining standard tolerances range from plus or minus 0.001mm.
The cost of CNC machining is determined by the material, machining costs, labor costs, and the tooling and surface finish involved. Feel free to contact us for a quick quote.
Got any more questions?
Ultimate Guide
to FC PCB Assembly
to FC PCB Assembly
FC PCB Assembly Service
Various and Robust CNC Machining Services
Process 1
Prototyping
Zintilon's rapid prototype service bridges the gap between product concept and market during the product development. Advanced CNC machines such as Hermle 5 axis cnc milling centers, multiple international certifications, and top-notch CMM inspection ensure the accuracy and details of the prototype, meeting high standards of quality requirements.
- Advanced Technology: CNC, CMM inspection, elite engineers etc.
- Quick Response: full support to ensure problem solved.
- Customized service: customize precision machining solutions
Process 2
Production
Zintilon's on-demand production solution provides customers with a modern, efficient and customer-oriented production solution through its flexibility, high quality standards by our robust supply network and self-owned CNC shop, strict quality control inspection, etc.
- Reasonable planning: precision resource allocation to ensure quick cycle time.
- Machining SOP : advanced technology and strict QC processes.
- Flexible Production: from rapid prototyping (1-20pcs) to low-volume production (20-1000pcs).
Let’s Build Something Great, Together
