
| Category | Typical Grade / Build-up | Key Performance |
| Copper foil | RTF, RA, ED (Ra ≤ 3 µm) | 58 MS/m conductivity, thermal shock resistant |
| Resin system | High-Tg FR-4 (Tg 170 °C) | Tg 170–180 °C, low ΔT warpage |
| Polyimide (PI) | Tg ≥ 250 °C, flexible, 300 °C solderable | |
| Epoxy + filler (EM827, EXB-HT) | 70 % filler, CTE 11 ppm, 150 °C rated | |
| Reinforcement | Standard E-glass 2116/7628 | Low cost, CTE 16 ppm |
| Low-CTE aramid non-woven | CTE 6 ppm, density 1.3 g/cm³ | |
| Carbon-fiber / carbon-composite | In-plane λ 30–325 W/m·K, CTE –1.5–4 ppm | |
| Metal core / base | Aluminum IMS (5052/6061) | λ 1–2 W/m·K, light |
| Copper base (C1100) | λ 390 W/m·K, CTE 17 ppm | |
| Cu-Mo-Cu (CMC) laminate | λ 150–220 W/m·K, CTE 5.6–7 ppm | |
| Ceramic DBC (Al₂O₃/AlN) | λ 24–170 W/m·K, CTE 4.5–7 ppm | |
| Plug / fill resin | High-thermal epoxy plug (3 W/m·K) | CTE 18 ppm, 150 °C rated |
| Copper-paste plug | 3×10⁻⁵ Ω·cm, λ 20 W/m·K |
| Finish | Typical Thickness | Features |
| HAL-LF SnCu/Ni | 1–2 µm | Low cost, reworkable, good wetting |
| ENIG | Ni 3–5 µm + Au 0.05–0.1 µm | Flat, environmental, Al-wire bondable |
| ENEPIG | Ni 3–5 µm + Pd 0.05–0.1 µm + Au 0.03–0.05 µm | Sn solder + Al/Au wire, Pd blocks Ni migration |
| Immersion Ag | 0.15–0.3 µm | Low loss, flat, sulfur-sensitive |
| Immersion Tin | 0.8–1.2 µm | Compatible with any solder, flat |
| OSP | 0.2 µm | Lowest skin-effect, cheapest |
| Electroplated Hard Gold | Ni 3–5 µm + Au 0.5–1.5 µm | ≥10 000 plug cycles |
| Mixed finish | e.g., ENIG + selective hard gold | Solder + plug in one pass |
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We strictly control materials, processes, surface finishes, AOI, and flying probe tests to ensure consistent quality from prototype to mass production.
With advanced equipment and a professional team, we prioritize your order based on complexity and urgency.
We provide full technical support from quote to delivery. We respond quickly to any questions until you receive your PCBs and are fully satisfied.

