
| Category | Typical Grade / Build-up | Key Performance | Copper-Weight Range | Remarks |
| Copper foil | RTF, RA, ED (Ra ≤ 3 µm) | 58 MS/m conductivity, thermal shock resistant | 3–40 oz | Thick-copper favourite, less under-cut |
| Resin system | High-Tg FR-4 (Tg 170 °C) | Tg 170–180 °C, low ΔT warpage | ≤12 oz | Low-cost automotive & power mainstream |
| Polyimide (PI) | Tg ≥ 250 °C, flexible, 300 °C solderable | 3–10 oz | Thick-copper FPC, mil & aerospace | |
| Epoxy + filler (EM827, EXB-HT) | 70 % filler, CTE 11 ppm, 150 °C rated | 6–20 oz | Flow-blocking, replaces FR-4 | |
| Reinforcement | Standard E-glass 2116/7628 | Low cost, CTE 16 ppm | ≤10 oz | Conventional thick-copper boards |
| Low-CTE aramid non-woven | CTE 6 ppm, density 1.3 g/cm³ | ≤6 oz | Dimensionally stable, high moisture | |
| Carbon-fiber / carbon-composite | In-plane λ 30–325 W/m·K, CTE –1.5–4 ppm | ≥10 oz | Stiff + heat-spreader, non-etchable | |
| Metal core / base | Aluminum IMS (5052/6061) | λ 1–2 W/m·K, light | 3–6 oz | LED, small DC-DC |
| Copper base (C1100) | λ 390 W/m·K, CTE 17 ppm | 6–30 oz | EV, power modules | |
| Cu-Mo-Cu (CMC) laminate | λ 150–220 W/m·K, CTE 5.6–7 ppm | 10–40 oz | High-reliability aerospace power | |
| Ceramic DBC (Al₂O₃/AlN) | λ 24–170 W/m·K, CTE 4.5–7 ppm | 6–28 oz | Vacuum, 350 °C operation | |
| Plug / fill resin | High-thermal epoxy plug (3 W/m·K) | CTE 18 ppm, 150 °C rated | Inner ≥4 oz | Replaces PP powder, smoother surface |
| Copper-paste plug | 3×10⁻⁵ Ω·cm, λ 20 W/m·K | Blind/buried | Conductive + thermal, high cost |
| Process Parameter | Sample | Batch |
|---|---|---|
| Layers | 50L | 40L |
| Finished Board Thickness | 0.2-18.0 mm | 0.3-10.0 mm |
| Board Thickness Tolerance | ±8% | ±8% |
| Min Line Width/Spacing | 1.5 mil/1.5 mil | 2 mil/2 mil |
| Min Hole-to-Line Spacing | 5 mil | 5 mil |
| Max Processing Size | 1200 mm*600 mm | 570 mm*760 mm |
| Min Finished Size | 5 mm*5 mm | 50 mm*50 mm |
| Copper Thickness | 1/3 oz-12 oz | 1/3 oz-8 oz |
| Layer-to-Layer Alignment Accuracy | 0.8 mil | 1 mil |
| Min Through-Hole Diameter | 0.075 mm | 0.1 mm |
| Min Blind-Hole Diameter | 0.05 mm | 0.075 mm |
| Max Aspect Ratio | 35:1 | 30:1 |
| Etching Tolerance | ±10%/±0.8 mil | ±10%/±1 mil |
| Min Solder Mask Bridge | 2 mil | 3 mil |
| Impedance Control Tolerance | ±5% | ±7% |
| HDI Order | 8th order | 5th order |
| Surface Finishing Process | ENIG, E-Gold, HASL, Ni-Pd-Au, Thick E-Gold, ImSn, ImAg, OSP, etc. | ENIG, E-Gold, HASP, Ni-Pd-Au |
Simply upload your .gbr file to receive a quotation feedback within 24 hours. Our professional engineers will analyze your design to avoid misunderstandings, actively communicate with you, and provide a reasonable price.
We maintain a rigorous and responsible attitude toward materials, processes, surface treatments, A.O.I, and flying probe testing, ensuring consistent high quality from prototype manufacturing to mass production.
Equipped with advanced machinery and a professional engineering team to ensure fast delivery. We prioritize orders based on requirements and complexity. Customized delivery solution is also available to tailored to your needs.
For your benefit, we provide full-cycle technical support for each customer from quotation to delivery. We will respond quickly to any questions until you confirm satisfactory heavy copper PCBs.



