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Sip PCB Assembly
SiP PCB Assembly refers to a board-level packaging service centered on System-in-Package (SiP) technology. It integrates multiple bare chips, passive components, and even Micro-Electro-Mechanical Systems (MEMS) onto a single PCB/substrate to form a "subsystem-level board-level package".
- Maximum panel size 54 inches
- Maximum panel thickness 0.450 inches
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Our Sip PCB Assembly Service Capabilities
Zintilon Technology is committed to providing advanced SiP PCB assembly services to global users, supporting SiP PCB assembly from prototype production in the product R&D stage to small-batch manufacturing. From printing to assembly, we ensure to deliver efficient and reliable SiP PCB assembly solutions for you.
Sip PCB Assembly Materials
| Category | Recommended Model/Specification | Key Parameters | Remarks |
|---|---|---|---|
| Substrate | ① Coreless BT Build-up Board (ABF GX-13); ② Low-Temperature Co-fired Ceramic (LTCC) | Dk: 3.4@10 GHz; Df: 0.004; CTE: 11–13 ppm; LTCC supports embedded passives | Minimum line width/spacing: 12 µm/12 µm; supports 4–6 build-up layers |
| Dielectric Build-up Layer | ABF GX-92 / Panasonic R-1515 | Thickness: 5 µm; Laser-drilled hole diameter: 40 µm | Compatible with FC micro-bump systems |
| Copper Foil | Reverse Treated Foil (RTF) ≤ 1 oz | Surface roughness (Ra) ≤ 2 µm; low high-frequency loss | Suitable for millimeter-wave SiP |
| Encapsulation Adhesive | ① Low-Stress Epoxy (EP-121); ② High-Transmittance Silicone (OE-6650) | CTE: 26 ppm; Tg: 120–140°C; Light transmittance: ≥ 90% | Used for top potting or local encapsulation |
| Thermal Interface Material | Silicone Pad or TIM (2–5 W/m·K) | Thickness: 0.1–0.2 mm; Dielectric strength: ≥ 3 kV | Used between the package and housing/heat sink |
Sip PCB Assembly Surface Finishes
| Area | Process Combination | Thickness | Purpose |
|---|---|---|---|
| Entire Board | ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) | Ni 3–5 µm + Pd 0.05 µm + Au 0.03 µm | Compatible with FC micro-bumps, gold wire bonding, and SMT placement |
| High-Frequency Antenna Area | OSP (Organic Solderability Preservative) or ImAg (Immersion Silver) | 0.15–0.3 µm | Minimum skin effect loss; millimeter-wave insertion loss < 0.2 dB/inch |
| Edge Connector | Selective Hard Gold Plating | Ni 3–5 µm + Au 0.5–1.5 µm | Insertion life ≥ 10,000 cycles |
Why Choose Our
Sip PCB Assembly Service?
One-on-One Quotation
Simply upload your .gbr file to receive a quotation feedback within 24 hours. Our professional engineers will analyze your design to avoid misunderstandings, communicate with you, and provide a reasonable price.
High-Quality Assembled
We maintain a rigorous and responsible attitude toward materials, processes, surface treatments, A.O.I (Automated Optical Inspection), and flying probe testing, ensuring consistent high quality from prototype production to mass manufacturing.
Fast Delivery
Equipped with advanced machinery and a professional quotation team to ensure fast delivery. We prioritize orders based on requirements and complexity. Cutomized delivery sulution is also available.
Real-Time Communication
For your benefit, we provide full-cycle technical support for each customer from quotation to delivery. We will respond quickly to any questions until you confirm satisfactory SiP PCB assembly.
Sip PCB Assembly Standards
Zintilon ensures quality through our sip PCB assembly design and manufacturing standards from design to delivery by follow up IPC standards (IPC-2221C, IPC-6012E) to ensure manufacturability and reliability.
Parameter
Wire-Bond SiP
Flip-Chip SiP
Remark
Die bond area
Value/Requirement Pad + 0.2 mm per side
Source/Remarks Same
GB/T 44795-2024
Placement accuracy
Value/Requirement ±15 µm @ 3σ (wire)
Source/Remarks ±5 µm @ 3σ (flip)
JEDEC J-STD-035
NSMD pad opening
Value/Requirement Cu pad + 20–30 µm, reg. ±12 µm
Source/Remarks Same
IPC-2221C
Passive embed
Value/Requirement 0201-0603, 50 V, ±5 % tolerance
Source/Remarks Laser drill cavity, depth ≤0.1 mm
IPC-4761
Sip PCB Assembly Guidelines
Ensure precise tolerances, select appropriate materials, maintain clear CAD designs, and follow IPC for best results. Zintilon delivers accuracy, quality, and consistency in every sip PCB assembly.
Item
Value/Requirement
Source/Remarks
Micro-Bump Pitch
Value/Requirement ≥ 80 µm (mass production); 50 µm (laboratory)
Source/Remarks JEDEC JESD22-B117
Laser-Drilled Hole Diameter
Value/Requirement 40 µm ± 5 µm; Hole copper thickness ≥ 15 µm
Source/Remarks IPC-2221C
Line Width/Spacing
Value/Requirement 12 µm / 12 µm (ABF build-up layer)
Source/Remarks Insertion loss ≤ 0.25 dB/inch for 77 GHz high-frequency applications
Chip Cavity Opening
Value/Requirement Bare die periphery + 0.2 mm; Depth: 0.1–0.3 mm
Source/Remarks Prevents adhesive overflow to adjacent pads
Gold Wire Bonding Pad
Value/Requirement NSMD (Non-Solder-Mask-Defined); ≥ 100 µm × 100 µm; Pitch ≥ 75 µm
Source/Remarks Compatible with 25 µm gold wire
Encapsulation Adhesive Thickness
Value/Requirement Top potting: 0.3–0.8 mm; Local encapsulation: 0.2 mm
Source/Remarks Hardness: 60–95 Shore D; CTE: 26 ppm
Reflow Cycles
Value/Requirement ≤ 3 cycles; Peak temperature ≤ 260°C
Source/Remarks Meets MSL 3 requirements
Thermal Cycling
Value/Requirement -40 ↔ +125°C for 500 cycles; Wire tensile strength reduction ≤ 20%
Source/Remarks IPC-A-610 G Class 3
Our Custom Sip PCB Assembly Service for Various Industrial Applications
SiP PCB Assembly (System in Package PCB Assembly) leverages four core advantages: "ultra-high integration, cross-chip collaboration, miniaturized architecture, and low-power interconnection". It has become the "integrated functional hub" for high-end electronic devices, covering core application scenarios from portable terminals to cutting-edge computing power.
Sip PCB Assembly FAQs
We cooperate with multiple certification bodies and can handle CE certification, FCC certification, RoHS certification, FDA certification, etc.
We have a highly professional engineering team with extensive design experience in fields such as industrial control, consumer electronics, new energy, and medical devices.
Throughout the product development process, we confirm each step with the client. If the project design includes sample testing, we will conduct electrical performance testing, functional testing, performance testing, and reliability testing to ensure design quality.
Got any more questions?
Ultimate Guide
to Sip PCB Assembly
to Sip PCB Assembly
Sip PCB Assembly
Various and Robust Sip PCB Assembly Services
Prototype
Prototyping
From Gerber files to circuit boards, our professional engineering team provides you with the highest quality rigid PCB manufacturing services. We meticulously control every detail of the process, including drilling, electroplating, and AOI, ensuring precise control over trace spacing, thickness, and panel dimensions. We are committed to providing you with the most reliable PCB assembly.
- Complete production line
- Professional engineering support
- 10+ years‘ manufacturing experience
Production
Production
We have our own production lines and a robust manufacturing network. From PCB design, engineering, and manufacturing, we have sufficient capacity to provide you with professional and fast delivery services, whether for small or large batches. We spare no effort in providing consistent mass production services for your products.
- Strong supply chain team
- Competitive pricing
- One-stop service from design to delivery
Let’s Build Something Great, Together
