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Metal Core PCB Manufacturing
We build circuit layers on aluminum, copper, or ceramic cores (1–170 W/m·K) with high-thermal-conductivity dielectrics to create “PCB-level heat sinks” that remove heat 5–9× faster than FR-4.Multiple substrate choices.
- Maximum panel size: 630×1500 mm
- Up to 1L layers
- Maximum plate thickness: 4.00 mm
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Our Metal Core PCB Capabilities
Zintilon offers end-to-end metal-core fabrication—from 0.5 mm Al LED strips to 3 mm Cu power modules. We handle special dielectrics, plated through-holes, selective hard-gold, and vacuum reflow, delivering consistent thermal performance and electrical reliability.
Metal Core PCB Materials
| Layer | Typical Options | Key Performance | Thickness | Application Notes |
| Circuit Copper | ED/RA foil, 35–140 µm | 58 MS/m, plateable to 4 oz | 35–140 µm | High-power pads can be locally plated thicker |
| Thermal Dielectric | ① Epoxy + ceramic filler (1–3 W/m·K) | Electrically isolating, CTE matched | 50–200 µm | LED 1–2 W/m·K OK; >100 W supplies choose ≥5 W/m·K |
| ② Polyimide + BN (3–8 W/m·K) | Flexible, 300 °C solderable | 50–125 µm | Bendable heat-spreader | |
| ③ Nano-ceramic coat (>8 W/m·K, 6 kV breakdown) | Ultra-thin, high voltage | 25–75 µm | mmWave or high-voltage drivers | |
| Metal Core | ① Al 5052/6061 (205 W/m·K) | Light, cheap, extrudable | 0.5–3 mm | Cost-performance leader |
| ② Cu C1100 (385 W/m·K) | Best λ, heavy | 0.5–3 mm | EV power modules, lasers | |
| ③ Stainless 430 (16 W/m·K) | Corrosion-proof | 0.5–2 mm | Sensors, marine, chemical |
Metal Core PCB Capabilities
| Process Parameter | Sample | Batch |
|---|---|---|
| Layers | 50L | 40L |
| Finished Board Thickness | 0.2-18.0 mm | 0.3-10.0 mm |
| Board Thickness Tolerance | ±8% | ±8% |
| Min Line Width/Spacing | 1.5 mil/1.5 mil | 2 mil/2 mil |
| Min Hole-to-Line Spacing | 5 mil | 5 mil |
| Max Processing Size | 1200 mm*600 mm | 570 mm*760 mm |
| Min Finished Size | 5 mm*5 mm | 50 mm*50 mm |
| Copper Thickness | 1/3 oz-12 oz | 1/3 oz-8 oz |
| Layer-to-Layer Alignment Accuracy | 0.8 mil | 1 mil |
| Min Through-Hole Diameter | 0.075 mm | 0.1 mm |
| Min Blind-Hole Diameter | 0.05 mm | 0.075 mm |
| Max Aspect Ratio | 35:1 | 30:1 |
| Etching Tolerance | ±10%/±0.8 mil | ±10%/±1 mil |
| Min Solder Mask Bridge | 2 mil | 3 mil |
| Impedance Control Tolerance | ±5% | ±7% |
| HDI Order | 8th order | 5th order |
| Surface Finishing Process | ENIG, E-Gold, HASL, Ni-Pd-Au, Thick E-Gold, ImSn, ImAg, OSP, etc. | ENIG, E-Gold, HASP, Ni-Pd-Au |
Why Choose Our
Metal Core PCB Services?
One-on-One Quotation
Simply upload your .gbr file to receive a quotation feedback within 24 hours. Our professional engineers will analyze your design to avoid misunderstandings, actively communicate with you, and provide a reasonable price.
High-Quality Production
We maintain a rigorous and responsible attitude toward materials, processes, surface treatments, A.O.I, and flying probe testing, ensuring consistent high quality from prototype manufacturing to mass production.
Fast Delivery
Equipped with advanced machinery and a professional engineering team to ensure fast delivery. We prioritize orders based on requirements and complexity. Customized delivery solution is also available to tailored to your needs.
Instant Communication
For your benefit, we provide full-cycle technical support for each customer from quotation to delivery. We will respond quickly to any questions until you confirm satisfactory metal core PCBs.
Metal Core PCB Standards
Zintilon ensures quality through our Rigid PCB design and manufacturing standards from design to delivery by follow up IPC standards (IPC-2221C, IPC-6012E) to ensure manufacturability and reliability.
Item
Sub Item
Parameter
Thermal Performance
Design Key Thermal conductivity, dielectric layer
Empirical Value / Formula 1–8 W/m·K (LED 1–2 W/m·K; >100 W modules ≥5 W/m·K)
Design Key Board thermal resistance
Empirical Value / Formula ≤0.5 °C/W (3 mil ceramic ≈0.09 °C-in²/W)
Design Key Thermal via array
Empirical Value / Formula 0.3–0.5 mm dia, 1.0–1.5 mm pitch, 35–70 µm copper wall, filled with high-κ paste or copper
Design Key Base thickness
Empirical Value / Formula Al 0.5–3 mm (5052/6061); Cu 0.5–3 mm (C1100); thicker bases use step-drill or copper coin
Electrical & Material Standards
Design Key Breakdown voltage
Empirical Value / Formula ≥3 kV AC (general), ≥6 kV with nano-ceramic dielectric
Design Key Dk
Empirical Value / Formula 3.5–4.5 @ 1 MHz, tolerance ±0.2 (low-Dk ceramic for RF)
Design Key Copper foil
Empirical Value / Formula ED/RA 1–10 oz; local plate to 20 oz; Rz ≤3 µm to reduce under-cut
Design Key CTE match
Empirical Value / Formula Al 23 ppm/°C vs Cu 17 ppm/°C → symmetrical stack + low-flow adhesive, warpage ≤0.75 % diagonal
Design Key Peel strength
Empirical Value / Formula ≥1.5 N/mm after thermal stress
Mechanical & Manufacturing Rules
Design Key Min line/space
Empirical Value / Formula outer 0.1 mm (4 mil), inner 0.13 mm (5 mil); prohibit <0.2 mm traces in heavy-copper zones
Design Key Hole-to-copper ring
Empirical Value / Formula ≥0.4 mm anti-tear; metal-base holes plugged with insulating resin before plating
Metal Core PCB Guidelines
Zintilon ensures quality through our Rigid PCB design and manufacturing standards from design to delivery by follow up IPC standards (IPC-2221C, IPC-6012E) to ensure manufacturability and reliability.
Dimension
Design Key
Empirical Value / Formula
Source / Notes
Thermal budget
Design Key Target RθJA ≤10 K/W (natural)
Empirical Value / Formula RθJA = RθJC + RθTIM + RθHS
Source / Notes Icepak/Flotherm verify, LED Tj ≤110 °C
Dielectric thickness
Design Key As thin as insulation allows
Empirical Value / Formula 1 kV → 75 µm nano-ceramic OK
Source / Notes Halving thickness cuts Rθ by 40 %
Thermal via array
Design Key 0.3–0.5 mm dia, 1.0–1.5 mm pitch, 35–70 µm copper wall
Empirical Value / Formula Filled/plugged, λ↑30 %
Source / Notes Use copper-filled or high-κ plug
Copper traces
Design Key Power ≥2 oz, signal 1 oz, selective plate
Empirical Value / Formula ΔT ≤20 °C @ 4 A / 2 oz
Source / Notes Avoid full-board thick Cu to save etch cost
Base thickness
Design Key 0.8–1.5 mm LED; ≥2 mm power modules
Empirical Value / Formula Thicker spreads heat but adds weight/cost
Source / Notes Match contact area to heat-sink
Machining
Design Key Al: CNC/V-cut; Cu: laser cut
Empirical Value / Formula ±0.1 mm, burr <20 µm
Source / Notes Mill thick Cu first, then cut to avoid delam
Surface color
Design Key Black anodize, matte black ε≈0.9
Empirical Value / Formula Extra 3–5 °C drop in natural convection
Source / Notes Outdoor luminaires must-have
Manufacturability
Design Key Al pre-heat 120 °C, back-drill ≤8 k rpm
Empirical Value / Formula Prevents CTE mismatch tear
Source / Notes Max Al panel 600 × 1200 mm, discuss with fab early
Our Custom Metal Core PCB Services for Various Industrial Applications
Prototyping and production PCBs from Zintilon have been applied to the various walks of life. The brilliant metal core PCB manufacturing simplifies the process of obtaining good-quality production PCBs.
Metal Core PCB FAQs
Project lead time and cost depend on its complexity. Zintilon will spare no effort to provide the most competitive prices and the fastest delivery time.
We understand that clients may need to make some adjustments after receiving the sample. Minor modifications can be done free of charge. However, if the modifications are substantial, we will need to reassess the price and delivery time.
We accept T/T and PayPal payments.
Got any more questions?
Ultimate Guide
to Metal Core PCB
to Metal Core PCB
Metal Core PCB Manufacturing
Various and Robust Metal Core PCB Services
Prototype
Prototyping
From Gerber files to circuit boards, our professional engineering team provides you with the highest quality metal core PCB manufacturing services. We meticulously control every detail of the process, including drilling, electroplating, and AOI, ensuring precise control over trace spacing, thickness, and panel dimensions. We are committed to providing you with the most reliable metal core PCBs.
- Complete production line
- Professional engineering support
- 10+ years‘ manufacturing experience
Production
Production
We have our own production lines and a robust manufacturing network. From metal core PCB design, engineering, and manufacturing, we have sufficient capacity to provide you with professional and fast delivery services, whether for small or large batches. We spare no effort in providing consistent mass production services for your products.
- Strong supply chain team
- Competitive pricing
- One-stop service from design to delivery
Let’s Build Something Great, Together
