ZTL TECH is now Zintilon. We’ve updated our name and logo for a fresh start. Check Now

Rigid PCB Manufacutring

Create mechanically strong and dimensionally stable non-bendable single layer or multilayer printed circuit boards with FR4, other substrates. One-stop rigid PCB manufacturing solution from prototype to low-volume.
  • Up to 50 layers
  • Maximum panel size 1200×600 mm
  • Maximum panel thickness 18.0 mm for prototype

Start a new PCB Quote

Rigid PCB parts prototypes

Please compress all .gbr files before uploading
All uploads are secure and confidential

Our Rigid PCB Manufacturing

Zintilon provides advanced rigid PCB manufacturing from prototyping to small-batch production. From raw-material cutting to final packaging, we deliver efficient and reliable rigid PCB manufacturing solutions no matter single-layer PCB or multilayer PCBs.
HASL LF PCB

Single-Layer Rigid PCB

Sky Blue Soldermask PCB

Double-Layer Rigid PCB

Complex Multilayer 1

Multi-Layer Rigid PCB

Rigid PCB Materials

Choose the best material based on mechanical strength, weight, processability, electrical performance, and thermal management.
MaterialCore CompositionThermal ConductivityElectrical InsulationMechanical StrengthWeightProcessing DifficultyElectrical PerformanceThermal DissipationTypical Applications
FR4Epoxy + Glass Fiber~0.3 W/m·KHigh (>20 kV/mm)High, prone to warpageLight (1.9 g/cm³)Easy, low costLow Dk, good for RFCopper foil + thermal viasComputers, phone motherboards
Aluminum PCBCircuit + Dielectric + Al~200 W/m·KMedium (≤2 kV)High, low warpageMedium (2.7 g/cm³)Requires depth routing, +30% costDk≈3, limited RFAluminum coreLED strips, auto power modules
Copper PCBCircuit + Dielectric + Cu~380 W/m·KSame as Al, thinner dielectricVery high, heavyHeavy (8.9 g/cm³)Hard, 3–5× costSame as AlCopper core, best thermalLasers, RF amps, military high-power modules

Rigid PCB Capabilities

Process ParameterSampleBatch
Layers50L40L
Finished Board Thickness0.2-18.0 mm0.3-10.0 mm
Board Thickness Tolerance±8%±8%
Min Line Width/Spacing1.5 mil/1.5 mil2 mil/2 mil
Min Hole-to-Line Spacing5 mil5 mil
Max Processing Size1200 mm*600 mm570 mm*760 mm
Min Finished Size5 mm*5 mm50 mm*50 mm
Copper Thickness1/3 oz-12 oz1/3 oz-8 oz
Layer-to-Layer Alignment Accuracy0.8 mil1 mil
Min Through-Hole Diameter0.075 mm0.1 mm
Min Blind-Hole Diameter0.05 mm0.075 mm
Max Aspect Ratio35:130:1
Etching Tolerance±10%/±0.8 mil±10%/±1 mil
Min Solder Mask Bridge2 mil3 mil
Impedance Control Tolerance±5%±7%
HDI Order8th order5th order
Surface Finishing ProcessENIG, E-Gold, HASL, Ni-Pd-Au, Thick E-Gold, ImSn, ImAg, OSP, etc.ENIG, E-Gold, HASP, Ni-Pd-Au

Why Choose Our Rigid PCB Services?

1 2

One-on-One Quotation

Simply upload your .gbr file to receive a quotation feedback within 24 hours. Our professional engineers will analyze your design to avoid misunderstandings, actively communicate with you, and provide a reasonable price.

1 3

High-Quality Production

We maintain a rigorous and responsible attitude toward materials, processes, surface treatments, A.O.I, and flying probe testing, ensuring consistent high quality from prototype manufacturing to mass production.

1 1

Fast Delivery

Equipped with advanced machinery and a professional engineering team to ensure fast delivery. We prioritize orders based on requirements and complexity. Customized delivery solution is also available to tailored to your needs.

1 4

Instant Communication

For your benefit, we provide full-cycle technical support for each customer from quotation to delivery. We will respond quickly to any questions until you confirm satisfactory rigid PCBs.

Rigid PCB Manufacturing Standards

Zintilon ensures quality through our Rigid PCB design and manufacturing standards from design to delivery by follow up IPC standards (IPC-2221C, IPC-6012E) to ensure manufacturability and reliability.

Item

Red-Line Value

Source / Remarks

Design
Parameter Min. line width / spacing
Economical ≥3 mil (mass) ≥2.5 mil (sample)
High-End IPC-2221C + factory limit
Parameter Min. mechanical hole dia.
Economical ≥0.15 mm
High-End Drilling capability floor
Parameter Hole-to-hole spacing
Economical ≥0.4 mm (mass) ≥0.2 mm (sample)
High-End Prevent drill breakout
Parameter Board-thickness : hole-dia. ratio
Economical ≤12 : 1 (mass) ≤16 : 1 (sample)
High-End Drilling capability ceiling
Parameter Pad diameter
Economical ≥hole + 0.3 mm (mass) +0.2 mm (sample)
High-End Prevent breakout ring
Parameter Line-to-pad transition
Economical 45° or arc R≥0.1 mm
High-End Eliminate stress notch
Parameter NSMD opening
Economical Pad + 20–30 µm, reg. ±12 µm
High-End IPC-2221C
Manufacturing & Lamination
Parameter Layer count
Economical ≤26 layers (mass) ≤30 layers (sample)
High-End Factory ceiling
Parameter Board-thickness tolerance
Economical ≤1.0 mm: ±0.1 mm; >1.0 mm: ±10 %
High-End IPC-6012E
Parameter Hole copper thickness
Economical ≥25 µm (Class 2) ≥35 µm (automotive/high-current)
High-End IPC-6012E
Parameter Hole-diameter tolerance
Economical PTH ±0.075 mm, NPTH ±0.05 mm
High-End IPC-6012E
Parameter Warpage
Economical ≤0.75 % (diagonal), HDI/RF ≤0.5 %
High-End IPC-6012E
Parameter Lamination symmetry
Economical Copper/dielectric/glass mirror, Δ≤10 %
High-End Anti-warpage

Rigid PCB Design Guidelines (From DFM to Delivery)

Zintilon ensures quality through our Rigid PCB design standards. We are committed to precise measurement, delivering consistently high-quality results to our customers by follow up IPC standards (IPC-2221A, IPC-6012D, IPC-7351) to ensure manufacturability and reliability.

Item

Parameter

Economical

High-End

Stack-up and Impedance
Parameter Min. Trace/Space
Economical ≥0.1 mm (4 mil)
High-End ≥0.075 mm (3 mil)
Parameter Inner Layer Annular Ring
Economical ≥0.1 mm
High-End ≥0.075 mm
Parameter Hole-to-Copper
Economical ≥0.15 mm
High-End ≥0.1 mm
Parameter Differential Impedance
Economical ±10%
High-End ±5%
Parameter Stackup Symmetry
Economical Recommended
High-End Required to prevent warpage
Holes and Drilling
Parameter Mechanical drill
Economical ≥0.15 mm
Parameter Laser blind via
Economical 0.05–0.1 mm
Parameter Aspect ratio
Economical ≤8:1 (mechanical), ≤1:1 (laser)
Parameter Back drill stub
Economical ≤0.05 mm (for high-speed signals)
Solder Mask & Silkscreen
Parameter Solder Mask Bridge
Economical ≥0.1 mm (4 mil), LPI Photopolymer Ink, Green as Default
Parameter Silkscreen Line Width
Economical ≥0.15 mm, Character Distance from Pads ≥0.15 mm, White Ink for Best Visibility
Dimension and Tolerance
Parameter Board Thickness Tolerance
Economical ±10% (Standard), ±0.05 mm (High-End)
Parameter Warpage
Economical ≤0.75% (IPC), ≤0.5% (HDI/High-Frequency)
Parameter ≤0.75% (IPC), ≤0.5% (HDI/High-Frequency)
Economical ±0.1 mm, V-Cut Remaining Thickness: 0.3-0.4 mm

Our Rigid PCB for Various Industrial Applications

Thanks to its four core strengths—dimensional stability, high load-bearing capacity, low cost, and high layer count—rigid PCB has become the “universal base” of the electronics industry, spanning everything from daily consumer goods to space applications. From phone mainboards to satellite power supplies, from household LEDs to 800 G switch backplanes—whenever you need “stable, dense, economical, and high-current,” rigid PCB at Zintilon is the first and best choice.

Rigid PCB FAQs

We accept T/T and PayPal payments.

We understand that clients may need to make some adjustments after receiving the sample. Minor modifications can be done free of charge. However, if the modifications are substantial, we will need to reassess the price and delivery time.

Project lead time and cost depend on its complexity. Zintilon will spare no effort to provide the most competitive prices and the fastest delivery time.
Got any more questions?
Ultimate Guide 
to Rigid PCB

Rigid PCB Manufacturing

Robust Rigid PCB Manufacturing
pcb proto2
Prototype

Prototyping

From Gerber files to circuit boards, our professional engineering team provides you with the highest quality rigid PCB manufacturing services. We meticulously control every detail of the process, including drilling, electroplating, and AOI, ensuring precise control over trace spacing, thickness, and panel dimensions. We are committed to providing you with the most reliable rigid PCBs.
  • Complete production line
  • Professional engineering support
  • 10+ years‘ manufacturing experience
Closeup,Of,Lot,Of,Electronic,Printed,Circuit,Boards,With,Lots
Production

Production

We have our own production lines and a robust manufacturing network. From rigid PCB design, engineering, and manufacturing, we have sufficient capacity to provide you with professional and fast delivery services, whether for small or large batches. We spare no effort in providing consistent mass production services for your products.
  • Strong supply chain team
  • Competitive pricing
  • One-stop service from design to delivery

Rigid PCB
Services at Zintilon


Differences Between Rigid PCB and Flexible PCB

  • Bendability: Rigid PCB cannot be bent, while flexible PCB can be repeatedly folded or curled.
  • Substrate Material: Rigid PCB is mainly based on hard substrates such as FR4, while flexible PCB uses thin films like PI or PET as substrates.
  • Thickness and Weight: Flexible PCB is thinner and lighter, suitable for space-constrained scenarios.
  • Application Scenarios: Rigid PCB carries high-pin-count devices, while flexible PCB is used for dynamic connections or 3D wiring.

Rigid PCB Pros & Cons

Advantages

  • High Mechanical Strength — resists bending and shock, carries large devices without deformation
  • Dimensional Stability — low CTE, long-term warpage ≤0.75 %
  • Low Cost — FR4 bulk price is low, mature process, fast lead time
  • High Layer Count — 1-50+ layers, thick copper 20 oz, 300 A current
  • Mature Process — 99 % of global lines compatible, full certifications (AEC-Q100/Class 3)

 

Disadvantages

  • Non-bendable — cannot be folded or dynamically flexed
  • Heavy — 30-50 % heavier than flexible boards
  • Low Thermal Conductivity — FR4 body 0.3 W/m·K, needs extra heat design
  • Thick-Copper Processing Difficulty — 4 oz+ needs special plating & lamination
  • High-Frequency Loss — Df≈0.02@10 GHz, needs low-loss material swap
Let’s Build Something Great, Together