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Rigid Flex PCB Manufacturing

We bond rigid FR4/PI layers and flexible PI films into one single multilayer board. The rigid areas carry high-pin-count parts; the flex arms fold in 3-D space—no connectors, no cables, one continuous interconnect.
  • Up to 20 layers total
  • Max panel size: 800×540 mm
  • Minimum line width/line spacing for prototype: 1.5mil/1.5mil

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Rigid Flex PCB parts prototypes

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Our Rigid-Flex PCB Capabilities

Zintilon closes the gap between concept and creation in rigid-flex PCB manufacturing. From first-turn prototypes to high-reliability production runs, our advanced manufacturing network and deep engineering know-how deliver speed and unwavering quality—so your rigid-flex designs fold, fit, and function exactly as you imagined.
Flex Rigid Circuit1

Single Layer Rigid Flex PCB

Flex Rigid Circuit 2

Double Layer Rigid Flex PCB

Flex Rigid Circuit3

Multilayer Layer Rigid Flex PCB

Rigid Flex PCB Materials

Pick the stack-up that matches your temperature → frequency → thermal → cost targets.
Rigid Side (R)Flex Side (F)Bond-PlyKey FeaturesTypical Apps
FR4 Tg 130–150 °CPI 25 µm + RA copperAcrylic (1–2 mil)Low cost, 100 k bends, 260 °C solderPhone hinge, keyboard tail
High-Tg FR4 >170 °CPI 25 µm + RA copperLow-flow epoxyLead-free 260 °C, anti-delamAutomotive ECU, industrial
Rogers RO4350BLCP 25 µm + RA copperNo-flow, heat-pressDf ≤0.004@10 GHz, stable Dk5G mmWave, 77 GHz radar
PI laminate Tg≥250 °CPI 25 µm + RA copperPI hot-meltAll-PI, matched CTE, 300 °CAero engine bay, medical endoscope
Al-MCPCB 1–3 mmPI 12.5 µm + RA copperThermally-conductive epoxy 1–5 W/m·KVert. thermal 1–5 W/m·K, 2 kVLED bar, auto power module
Cu-MCPCB 0.5–3 mmPI 12.5 µm + RA copperAg-sinter paste380 W/m·K, 300 A currentLaser diode, 5G AAU PA
Modified low-CTE PIPI 25 µm + RA copperLow-flow epoxyCTE 15–20 ppm, –55~125 °C cyclesAuto BMS, mil high-rel

Rigid-Flex PCB Capabilities

Process ParameterSampleBatch
Layer Count20L16L
Panel Size800 mm × 540 mm400 mm × 540 mm
Finished Board Thickness0.25-5.0 mm0.25-3.2 mm
Minimum Line Width/Spacing1.5 mil / 1.5 mil2 mil / 2 mil
Minimum Hole-to-Line Spacing4 mil5 mil
Copper Thickness1/3 oz – 3 oz1/3 oz – 2 oz
Layer-to-Layer Alignment Accuracy0.8 mil1 mil
Minimum Through-Hole Diameter0.075 mm0.1 mm
Minimum Blind-Hole Diameter0.05 mm0.05 mm
Maximum Aspect Ratio16:112:1
Etching Tolerance±10% / ±0.8 mil±10% / ±1 mil
Minimum Solder Mask Bridge2 mil3 mil
Impedance Control Tolerance±5%±7%
Surface Finishing ProcessENIG, E-Gold, HASL, Ni-Pd-Au, Thick E-Gold, ImSn, ImAg, OSPENIG, E-Gold, HA

Why Choose Our Rigid-Flex PCB Services?

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One-on-One Quotation

Simply upload your .gbr file to receive a quotation feedback within 24 hours. Our professional engineers will analyze your design to avoid misunderstandings, actively communicate with you, and provide a reasonable price.

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High-Quality Production

We maintain a rigorous and responsible attitude toward materials, processes, surface treatments, A.O.I, and flying probe testing, ensuring consistent high quality from prototype manufacturing to mass production.

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Fast Delivery

Equipped with advanced machinery and a professional engineering team to ensure fast delivery. We prioritize orders based on requirements and complexity. Customized delivery solution is also available to tailored to your needs.

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Instant Communication

For your benefit, we provide full-cycle technical support for each customer from quotation to delivery. We will respond quickly to any questions until you confirm satisfactory rigid-flex PCBs.

Rigid Flex PCB Standards

Zintilon ensures quality through our Rigid PCB design and manufacturing standards from design to delivery by follow up IPC standards (IPC-2221C, IPC-6012E) to ensure manufacturability and reliability.

Stiffeners & Mechanical Support

Spec

Arc corners R
≥0.5 mm; teardrop width changes
Flex zone & rigid islands
No BGA/QFN in flex zone; high-pin parts on rigid islands
Laser micro-vias
50–100 µm, buried in rigid areas; avoid in bends
Shielding & High-Speed
≥10 GHz: LCP flex + immersion Ag/ENEPIG, traces perpendicular to bend
EMI shield
0.012 mm PI conductive adhesive, skip bend zones
Connectors/keypads
FR4 or PI stiffener 0.2–0.5 mm, add copper ring around screw holes
Dynamic zone
avoid stiffener; if needed, PI 0.1 mm and keep away from crease

Rigid Flex PCB Guidelines

Ensure precise tolerances, select appropriate materials, maintain clear CAD designs, and follow IPC for best results. Zintilon delivers accuracy, quality, and consistency in every PCB prototype.

Application

Min Bend Radius

Layer Limit

Copper Position

Static fold-once
Min Bend Radius 6× board thickness
Layer Limit ≤2 L
Copper Position Any
Dynamic repeated
Min Bend Radius 31× board thickness
Layer Limit ≤2 L
Copper Position Neutral axis
High-cycle
Min Bend Radius ≥50× board thickness
Layer Limit 1 L
Copper Position Neutral axis

Our Rigid Flex PCB Services for Various Industrial Applications

From foldable phone hinges on aluminum cores to copper-cored BMS harnesses in electric vehicles, from PTFE 5G mmWave boards to PI implants in the human body, from high-Tg industrial workhorses to full-temp ceramic birds in aerospace—rigid-flex PCBs carry the load where rigidity is needed, bend where space is tight, route in 3-D, cut weight in half, and never quit.

Rigid Flex PCB FAQs

Project lead time and cost depend on its complexity. Zintilon will spare no effort to provide the most competitive prices and the fastest delivery time.

We understand that clients may need to make some adjustments after receiving the sample. Minor modifications can be done free of charge. However, if the modifications are substantial, we will need to reassess the price and delivery time.

We accept T/T and PayPal payments.
Got any more questions?
Ultimate Guide 
to Rigid Flex PCB

Rigid Flex PCB Manufacturing

Various and Robust Rigid Flex PCB Services
flex rigid pcb
Prototype

Prototyping

From Gerber files to circuit boards, our professional engineering team provides you with the highest quality rigid-flex PCB manufacturing services. We meticulously control every detail of the process, including drilling, electroplating, and AOI, ensuring precise control over trace spacing, thickness, and panel dimensions. We are committed to providing you with the most reliable rigid-flex PCBs.
  • Complete production line
  • Professional engineering support
  • 10+ years‘ manufacturing experience
flex rigid pcbs
Production

Production

We have our own production lines and a robust manufacturing network. From rigid-flex PCB design, engineering, and manufacturing, we have sufficient capacity to provide you with professional and fast delivery services, whether for small or large batches. We spare no effort in providing consistent mass production services for your products.
  • Strong supply chain team
  • Competitive pricing
  • One-stop service from design to delivery

Rigid Flex PCB
Services at Zintilon


Pros & Cons of Rigid-Flex PCB

Pros

  • 3-D Wiring: can bend/fold, eliminates connectors, assembly time ↓40 %
  • Weight & Space ↓: thickness ↓30 %, weight ↓15 %, volume ↓40 %
  • Reliability ↑: 10⁵ bends, 10 g vibration, AEC-Q100 certified

Cons

  • High Cost: PI film + RA copper, unit price ↑30-50 % vs FR-4
  • Layer Limited: dynamic zone ≤2 L, >3 L needs rigid island
  • Complex Process: 4× lamination, laser blind holes, ±5 µm precision
  • Thermal Management Difficult: rigid Tg≥170 ℃, flex ≤260 ℃
  • Short Storage: OSP ≤6 mo, ImAg ≤12 mo, needs vacuum bag

What is the difference between rigid flex and semi flex PCB?

Bend Mechanism
Rigid-Flex: Full PI film + RA copper, dynamic bends ≥10⁵ cycles
Semi-Flex: Thin FR-4 (0.1-0.3 mm) + RA copper, static bend ≤100 cycles

Bend Radius
Rigid-Flex: ≤0.3 mm dynamic
Semi-Flex: ≥1 mm static only

Layer Structure
Rigid-Flex: True PI flexible zones + FR-4 rigid zones, co-laminated
Semi-Flex: Single thin FR-4 layer, no PI film

Bend Zone
Rigid-Flex: Dynamic & repeated bending zones
Semi-Flex: One-time fold only, no repeated motion

Cost & Process
Rigid-Flex: 4× lamination, laser micro-vias, cost↑30-50 %
Semi-Flex: 1× lamination, standard drill, cost≈+10 %

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