
| Rigid Side (R) | Flex Side (F) | Bond-Ply | Key Features | Typical Apps |
| FR4 Tg 130–150 °C | PI 25 µm + RA copper | Acrylic (1–2 mil) | Low cost, 100 k bends, 260 °C solder | Phone hinge, keyboard tail |
| High-Tg FR4 >170 °C | PI 25 µm + RA copper | Low-flow epoxy | Lead-free 260 °C, anti-delam | Automotive ECU, industrial |
| Rogers RO4350B | LCP 25 µm + RA copper | No-flow, heat-press | Df ≤0.004@10 GHz, stable Dk | 5G mmWave, 77 GHz radar |
| PI laminate Tg≥250 °C | PI 25 µm + RA copper | PI hot-melt | All-PI, matched CTE, 300 °C | Aero engine bay, medical endoscope |
| Al-MCPCB 1–3 mm | PI 12.5 µm + RA copper | Thermally-conductive epoxy 1–5 W/m·K | Vert. thermal 1–5 W/m·K, 2 kV | LED bar, auto power module |
| Cu-MCPCB 0.5–3 mm | PI 12.5 µm + RA copper | Ag-sinter paste | 380 W/m·K, 300 A current | Laser diode, 5G AAU PA |
| Modified low-CTE PI | PI 25 µm + RA copper | Low-flow epoxy | CTE 15–20 ppm, –55~125 °C cycles | Auto BMS, mil high-rel |
| Process Parameter | Sample | Batch |
| Layer Count | 20L | 16L |
| Panel Size | 800 mm × 540 mm | 400 mm × 540 mm |
| Finished Board Thickness | 0.25-5.0 mm | 0.25-3.2 mm |
| Minimum Line Width/Spacing | 1.5 mil / 1.5 mil | 2 mil / 2 mil |
| Minimum Hole-to-Line Spacing | 4 mil | 5 mil |
| Copper Thickness | 1/3 oz – 3 oz | 1/3 oz – 2 oz |
| Layer-to-Layer Alignment Accuracy | 0.8 mil | 1 mil |
| Minimum Through-Hole Diameter | 0.075 mm | 0.1 mm |
| Minimum Blind-Hole Diameter | 0.05 mm | 0.05 mm |
| Maximum Aspect Ratio | 16:1 | 12:1 |
| Etching Tolerance | ±10% / ±0.8 mil | ±10% / ±1 mil |
| Minimum Solder Mask Bridge | 2 mil | 3 mil |
| Impedance Control Tolerance | ±5% | ±7% |
| Surface Finishing Process | ENIG, E-Gold, HASL, Ni-Pd-Au, Thick E-Gold, ImSn, ImAg, OSP | ENIG, E-Gold, HA |
Simply upload your .gbr file to receive a quotation feedback within 24 hours. Our professional engineers will analyze your design to avoid misunderstandings, actively communicate with you, and provide a reasonable price.
We maintain a rigorous and responsible attitude toward materials, processes, surface treatments, A.O.I, and flying probe testing, ensuring consistent high quality from prototype manufacturing to mass production.
Equipped with advanced machinery and a professional engineering team to ensure fast delivery. We prioritize orders based on requirements and complexity. Customized delivery solution is also available to tailored to your needs.
For your benefit, we provide full-cycle technical support for each customer from quotation to delivery. We will respond quickly to any questions until you confirm satisfactory rigid-flex PCBs.

