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FC PCB Assembly
FC PCB Assembly refers to a board-level assembly service that centers on Flip-Chip technology. It involves directly soldering the electrical side of the chip face-down onto the substrate pads, supplemented by processes such as underfilling, laser ball placement, and BGA packaging. This technology achieves "the shortest interconnection, the lowest parasitics, and the highest density".
- Maximum panel size 54 inches
- Maximum panel thickness 0.450 inches
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Our FC PCB Assembly Service Capabilities
Zintilon Technology is committed to providing advanced FC PCB assembly services to global users, supporting FC PCB assembly from prototype production in the product R&D stage to small-batch manufacturing. From printing to assembly, we ensure to deliver efficient and reliable FC PCB assembly solutions for you.
FC PCB Assembly Materials
| Layer | Recommended Model/Specification | Key Parameters | Remarks |
|---|---|---|---|
| Chip Bump | High-lead 95Pb5Sn (C4) or SAC305 micro-bump | Diameter: 60–100 µm; Height: 50–80 µm; Pitch: 80–150 µm | High-lead bumps have a melting point of 320°C and can withstand high temperatures in subsequent processes; lead-free bumps require vacuum reflow to prevent voids |
| UBM (Under-Bump Metallization) | Ti/Cu/Ni/Au or Al/Ni(V)/Cu | Total thickness: 0.5–1.0 µm; Ni layer: 0.3 µm (prevents diffusion) | Determines bump shear strength ≥ 6 g/bump (per JEDEC JESD22-B117) |
| Carrier/Substrate | ① BT Resin Core (ABF GX-13); ② Coreless + Build-up | Dk: 3.4@10 GHz; Df: 0.004; CTE: 11–13 ppm | Minimum line width/spacing: 12 µm/12 µm |
| Dielectric Build-up Layer | ABF GX-92 or Panasonic R-1515 | Thickness: 5 µm; Laser-drilled hole diameter: 40 µm | Compatible with 40 µm laser vias |
| Solder Mask | Photosensitive Black LDI Ink | Thickness: 15–20 µm; Resolution: 25 µm; Withstands 288°C for 10 s | Prevents flux from contaminating bumps |
FC PCB Assembly Surface Finishes
| Process | Thickness | Advantages in FC | Limitations |
|---|---|---|---|
| ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) | Ni 3–5 µm + Pd 0.05–0.1 µm + Au 0.03–0.05 µm | Compatible with high-lead/lead-free bumps; suitable for both wire bonding and soldering; resistant to black nickel | Highest cost; requires palladium thickness control |
| ENIG (Electroless Nickel Immersion Gold) | Ni 3–5 µm + Au 0.05 µm | Suitable for conventional FC-BGA; flatness < 0.3 µm | Risk of black nickel; prone to embrittlement in high-lead reflow |
| Immersion Tin (ImSn) | 0.8–1.2 µm | Compatible with SAC bumps; thin interfacial IMC; low voids | Storage life: 6 months; prone to tin whisker growth |
| OSP (Organic Solderability Preservative) | 0.15–0.3 µm | Ideal for RF-FC hybrid boards; minimal skin effect loss | Not resistant to multiple high-temperature cycles; limited to one-time reflow |
Why Choose Our
FC PCB Assembly Service?
One-on-One Quotation
Simply upload your .gbr file, and you will receive a quotation feedback within 24 hours. Our professional engineers will analyze your design to avoid misunderstandings, communicate with you, and provide a reasonable price.
High-Quality Assembled
We maintain a rigorous and responsible attitude towards materials, processes, surface treatments, A.O.I (Automated Optical Inspection), and flying probe testing, ensuring consistent high quality from prototype production to mass production.
Fast Delivery
Equipped with advanced machinery and a professional quotation team to ensure fast delivery. We prioritize orders based on order requirements and complexity. Cutomized delivery sulution is also available.
Real-Time Communication
For your benefit, we provide full-process technical support for each customer from quotation to delivery. We will respond quickly to any of your questions until you confirm that you have received satisfactory FC PCB Assembly products.
FC PCB Assembly Standards
Zintilon ensures quality through our fc PCB assembly design and manufacturing standards from design to delivery by follow up IPC standards (IPC-2221C, IPC-6012E) to ensure manufacturability and reliability.
Item
Subitem
Spec
Placement Accuracy
Value/Requirement Placer accuracy
Source/Remarks ±10 µm @ 3σ (Cpk≥1.33); ±5 µm for 01005 flip-chip
Value/Requirement Flux dip
Source/Remarks film 20–40 µm, cover ≥75 % bump height
Value/Requirement Self-alignment window
Source/Remarks mis-alignment ≤50 % pad width still pulls-in
Critical Dimensions & Alignment
Value/Requirement Solder-mask opening
Source/Remarks Ø = Cu pad + 20–30 µm, reg. accuracy ±12 µm
Value/Requirement Warpage
Source/Remarks ≤0
FC PCB Assembly Guidelines
Ensure precise tolerances, select appropriate materials, maintain clear CAD designs, and follow toolpath optimization for best results. Zintilon delivers accuracy, quality, and consistency in every FC PCB assembly.
Item
Value/Requirement
Source/Remarks
Bump Pitch
Value/Requirement Minimum 80 µm (mass production); 50 µm (laboratory)
Source/Remarks JEDEC JESD22-B117
Bump Diameter
Value/Requirement 60–100 µm (1:1.2 ratio with pitch)
Source/Remarks Shear strength ≥ 6 g/bump
Carrier Pad
Value/Requirement NSMD (Non-Solder-Mask-Defined); opening 25 µm larger than copper pad
Source/Remarks Reduces stress concentration
Solder Mask Opening (SRO)
Value/Requirement Ø = Copper pad + 20–30 µm; alignment accuracy ±12 µm
Source/Remarks Prevents solder mask from covering bumps
Underfill
Value/Requirement Capillary epoxy resin; CTE: 26–30 ppm; Tg: 120–140°C
Source/Remarks Filling time < 30 s; voids < 5%
Reflow Profile (High-Lead C4)
Value/Requirement Peak temperature: 320–350°C; N₂ atmosphere; oxygen < 50 ppm
Source/Remarks Prevents oxidative voids
Reflow Profile (Lead-Free SAC)
Value/Requirement Peak temperature: 240–250°C; vacuum stage: 5 mbar/10 s
Source/Remarks Void rate < 1%
Warpage
Value/Requirement Carrier warpage after reflow ≤ 0.3% (FC-BGA)
Source/Remarks Prevents bump cold soldering
Test Pad
Value/Requirement Reserve 0.2 mm × 0.2 mm copper window on the carrier periphery
Source/Remarks Shared by ICT (In-Circuit Test) and X-Ray
Our Custom FC PCB Assembly Service for Various Industrial Applications
FC PCB Assembly (Flip-Chip PCB Assembly) leverages four core advantages: "high-density interconnection, low parasitic parameters, high heat dissipation efficiency, and strong mechanical stability". It has become the "high-performance core carrier" for high-end electronic devices, covering key application scenarios from precision sensing to cutting-edge computing power.
FC PCB Assembly FAQs
We cooperate with multiple certification bodies and can handle CE certification, FCC certification, RoHS certification, FDA certification, etc.
We have a highly professional engineering team with extensive design experience in fields such as industrial control, consumer electronics, new energy, and medical devices.
Throughout the product development process, we confirm each step with the client. If the project design includes sample testing, we will conduct electrical performance testing, functional testing, performance testing, and reliability testing to ensure design quality.
Got any more questions?
Ultimate Guide
to FC PCB Assembly
to FC PCB Assembly
FC PCB Assembly Service
Various and Robust FC PCB Assembly Services
Prototype
Prototyping
From Gerber files to circuit boards, our professional engineering team provides you with the highest quality rigid PCB manufacturing services. We meticulously control every detail of the process, including drilling, electroplating, and AOI, ensuring precise control over trace spacing, thickness, and panel dimensions. We are committed to providing you with the most reliable PCB assembly.
- Complete production line
- Professional engineering support
- 10+ years‘ manufacturing experience
Production
Production
We have our own production lines and a robust manufacturing network. From PCB design, engineering, and manufacturing, we have sufficient capacity to provide you with professional and fast delivery services, whether for small or large batches. We spare no effort in providing consistent mass production services for your products.
- Strong supply chain team
- Competitive pricing
- One-stop service from design to delivery
Let’s Build Something Great, Together
